»Ê¹Ú²©²ÊÍøÖ· is the industry leader in thin electronics custom manufacturing.
America’s custom manufacturer for substrates, FPCB, packaging, assembly, test and engineering services for state-of-the art thin electronics.
»Ê¹Ú²©²ÊÍøÖ· introduces Nobleflexâ„¢ and Ultraflexâ„¢ advanced substrates and FPCBs with features at 1um.
What We Do
We are the semiconductor manufacturing service provider that specializes in development and production of  thin substrates, IC packaging and chip-on-flex assembly. »Ê¹Ú²©²ÊÍøÖ· (ASI) thin-device capability is based on Semiconductor-on-Polymerâ„¢ packaging that makes the thinnest devices and semiconductor substrates possible. ASI is a global provider of a complete range of services for thin electronic system manufacturing. Our extensive expertise, capabilities, and facilities enable us to support your program requirements for new product development and volume manufacturing.
Services & Products
»Ê¹Ú²©²ÊÍøÖ·’s advanced packaging technology and services provide thin capabilities. ASI’s offerings include Semiconductor-on-Polymerâ„¢ chip scale packaging, chip-on-flex assembly and a wide variety of engineering and design services. See List of Services & Products below.
Design & Prototyping
SoP Packaging
Assembly & Test
FleX-ICs
Advanced Substrates
Development Kits
Wearables & Labels
Investors
Advanced Packaging is the future for semiconductor technology. »Ê¹Ú²©²ÊÍøÖ·’s Semiconductor-on-Polymerâ„¢ (SoP) produces the thinnest packaged ICs possible and is a revolutionary process for protected Fan-In. SoP enables next generation, low cost, high reliability, ultra-thin integrated circuits that greatly improve the ability to integrate semiconductor functionality for thin PCB, Fan-Out, Heterogenous Integration and multi-chip advanced packaging. Interested in finding out more?